Printed circuit boards, otherwise known as PCB are found in almost all electronic devices. In manufacturing of PCB, electricians who are amateurs can make their own boards by drawing a design and then giving it to the manufacturer. There are three types; single sided, multi layered and double side boards. They are usually conducted with nickel, copper or aluminum material, and the type used is determined by the complexity and density of the circuits. The process of making them is described below.
A conductive material is used to plate the backing. Conduction between the layers is enhanced by drilling holes into the backing. To remove any small conductor particles that may be present, the board is scrubbed. Filtration process is applied to recycle the recovered particles. This is because, if not recycled, the copper may form a mixture with the other wastes and then become quite hazardous to the environment.
The board is then cleaned. Etching also takes place to allow for proper adhesion in the next stage. Once this has been carried out, there is an addition of another layer of conductor. The process of electrolysis copper plating is applied in order to conduct the holes that had been drilled previously. Both alkaline based and acidic based solutions such as copper sulfate can be used to enhance pH balance.
Photo imaging is used to achieve the final design of the circuit. The final thickness is also arrived at by electroplating copper. Protection of the final circuits in the next etching is quite vital and hence, a thin layer of tin or lead solder should be applied. The copper will not form the final circuit and should therefore be removed. Sulfuric acid or a solution containing ammonia is used to etch away the unwanted copper.
Obtaining alternative resist can be achieved by use of other compounds that are photosensitive or organic. They can be used in their dry or wet forms. When exposed to ultraviolet light, they become hard.
The resists that are in liquid form can be applied using a roller, squeegee, spray or silk screen. This liquid can also be applied to the surface on one or both sides of the surface. Finer circuits can be achieved by using light.
The last stage is the formation of multi layer panels. This is done by assembling together the inner cores of the layer. The assembled panels take the shape of a book that is composed of copper foil that has epoxy sheets alternating with each other.
High heat and pressure are applied to the book which is placed in a lamination press. A bond will be formed as the epoxy layers are melted down by the intense heat and pressure. Holes are drilled into it. However, this should only be done after it has been trimmed and buffed as required. The desired results can only be achieved by following the required procedure well and adhering to each and every detail in the stages involved in manufacturing of PCB.
A conductive material is used to plate the backing. Conduction between the layers is enhanced by drilling holes into the backing. To remove any small conductor particles that may be present, the board is scrubbed. Filtration process is applied to recycle the recovered particles. This is because, if not recycled, the copper may form a mixture with the other wastes and then become quite hazardous to the environment.
The board is then cleaned. Etching also takes place to allow for proper adhesion in the next stage. Once this has been carried out, there is an addition of another layer of conductor. The process of electrolysis copper plating is applied in order to conduct the holes that had been drilled previously. Both alkaline based and acidic based solutions such as copper sulfate can be used to enhance pH balance.
Photo imaging is used to achieve the final design of the circuit. The final thickness is also arrived at by electroplating copper. Protection of the final circuits in the next etching is quite vital and hence, a thin layer of tin or lead solder should be applied. The copper will not form the final circuit and should therefore be removed. Sulfuric acid or a solution containing ammonia is used to etch away the unwanted copper.
Obtaining alternative resist can be achieved by use of other compounds that are photosensitive or organic. They can be used in their dry or wet forms. When exposed to ultraviolet light, they become hard.
The resists that are in liquid form can be applied using a roller, squeegee, spray or silk screen. This liquid can also be applied to the surface on one or both sides of the surface. Finer circuits can be achieved by using light.
The last stage is the formation of multi layer panels. This is done by assembling together the inner cores of the layer. The assembled panels take the shape of a book that is composed of copper foil that has epoxy sheets alternating with each other.
High heat and pressure are applied to the book which is placed in a lamination press. A bond will be formed as the epoxy layers are melted down by the intense heat and pressure. Holes are drilled into it. However, this should only be done after it has been trimmed and buffed as required. The desired results can only be achieved by following the required procedure well and adhering to each and every detail in the stages involved in manufacturing of PCB.
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